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Products
ISOLA FR408 PCB
Product name: ISOLA FR408 PCB Material: isola fr408 HIGH TG PCB Df (dissipation factor): 0.012 Dk (dielectric constant): 3.67 Glass transition temperature: TG180℃ Td: 380℃ Number of Layers: 8 layers Board thickness: 1.2mm Surface technology: Immersion gold Copper thickness: 1OZ Minimum line width/line spacing: 6mil/6mil Use: Communication equipment isola fr408 PCB
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ISOLA 370HR PCB
Product name: ISOLA 370HR PCB Material: isola 370hr HIGH TG PCB Df (dissipation factor): 0.021 Dk (dielectric constant): 4.04 Glass transition temperature: TG180℃ Td: 340℃ Number of Layers: 6 layers Board thickness: 1.0mm Surface technology: Immersion gold Copper thickness: 1OZ Minimum line width/line spacing: 4mil/4mil Use: data storage products
RO4350B Ceramic Hybrid High Frequency Plate
Product Name: RO4350B Ceramic Hybrid High Frequency Plate Board: Rogers RO4350B+FR4 Number of floors: 4 Plate thickness: 1.6mm Copper thickness: 1OZ Medium thickness: 0.508mm Dielectric constant: 3.48 Thermal conductivity: 0.69w/mk Flame retardant grade: V-0 Volume resistivity: 1.2 * 1010 Surface resistivity: 5.7 * 109 Density: 1.9gm/cm3 Surface technology: chemical deposition of gold Purpose: Communication instrument
RO4003C Ceramic Hybrid High Frequency Plate
Product Name: Ro4003C Ceramic Hybrid High Frequency Plate Board: Ro4003C+FR4 Plate thickness: 1.6mm Number of floors: 4 Medium thickness: 0.203mm Dielectric constant: 3.38 Thermal conductivity: 0.71w/mk Flame retardant grade: 94V-0 Volume resistivity: 1.7 * 1010 Surface resistivity: 4.2 * 109 Density: 1.8gm/cm3 Surface technology: Sinking gold Special process: resin plug hole, pad size 0.15mm * 0.3mm Copper thickness: 1OZ
RO3003+FR4 high-frequency mixing plate
Product Name: RO3003+FR4 High Frequency Hybrid Plate Material: Rogers RO3003+FR-4 Number of Layers: Six Layers Plate thickness: 1.6mm Copper thickness: 1OZ Dielectric constant: 3.0 Medium thickness: 0.254mm Thermal conductivity: 0.5w/mk Flame retardant grade: V-0 Volume resistivity: 1 * 107 Surface resistivity: 1 * 107 Density: 2.1gm/cm3 Surface technology: chemical immersion gold+metal edging Blind hole structure: L1-L2, L5-L6 Purpose: Radar level gauge
Rogers RO4003C+FR4 High Frequency Hybrid Plate
Product Name: RO4003C+FR4 High Frequency Hybrid Plate Board: Rogers RO4003C+FR4 Number of floors: 6 Plate thickness: 1.2mm Copper thickness: 1OZ Medium thickness: 0.508mm Dielectric constant: 3.38 Thermal conductivity: 0.71w/mk Flame retardant grade: 94V-0 Volume resistivity: 1.7 * 1010 Surface resistivity: 4.2 * 109 Density: 1.8gm/cm3 Purpose: RF communication instrument Surface technology: Sinking gold
RO4350B+FR4 high-frequency mixing plate
Product Name: RO4350B+FR4 High Frequency Hybrid Plate Board: Rogers RO4350B+FR4 Number of floors: 4 Plate thickness: 1.5mm Copper thickness: 1OZ Medium thickness: 0.254 Dielectric constant: 3.48 Thermal conductivity: 0.69w/mk Flame retardant grade: 94V-0 Volume resistivity: 1.2 * 1010 Surface resistivity: 5.7 * 109 Density: 1.9gm/cm3 Surface technology: Sinking gold
Product Name: RO4350B+FR4 High Frequency Hybrid Plate Board: Rogers RO4350B+FR4 Number of floors: 4 Plate thickness: 1.6mm Copper thickness: Finished copper thickness of 1OZ Impedance: 50 ohms Medium thickness: 0.508MM Dielectric constant: 3.48 Thermal conductivity: 0.69w/mk Flame retardant grade: 94V-0 Volume resistivity: 1.2 * 1010 Surface resistivity: 5.7 * 109 Density: 1.9gm/cm3 Surface technology: Sinking gold
Millimeter wave radar circuit board
Product Name: Millimeter Wave Radar Circuit Board Board: Rogers RO3003+370HR Dielectric constant: High frequency material dielectric constant 3.0 Medium thickness: 5ml (0.127mm) Number of floors: 6 Plate thickness: 1.2mm Copper thickness: 1oz for inner and outer layers Via: resin plug hole Surface technology: Chemical deposition of silver Thermal conductivity: 0.69w/mk Loss: 0.001 Line width: 0.1mm Line spacing: 0.1mm Blind hole structure: L1-L2, L3-L6 Usage: Automotive radar, automotive sensing module
Rigid-flex PCB
Rigid-flex PCB is thin and changing in shape, RF PCB is an ideal solution for ultra -thin and ultra -light packaging. Rigid-flex PCB Material: FR4 / FR4 TG180 / FR4 TG170 Finish treatment: Immersion Gold Copper thickness: 1oz~ 2oz Resin plugging vias & Buried vias Impedance Controller Board