YDS is a high-tech enterprise specializing in the research and development, manufacturing and service of PCB (Printed Circuit Board) and PCBA (Printed Circuit Board Assembly).

RO4003C Ceramic Hybrid High Frequency Plate
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  • RO4003C Ceramic Hybrid High Frequency Plate

RO4003C Ceramic Hybrid High Frequency Plate

Product Name: Ro4003C Ceramic Hybrid High Frequency Plate Board: Ro4003C+FR4 Plate thickness: 1.6mm Number of floors: 4 Medium thickness: 0.203mm Dielectric constant: 3.38 Thermal conductivity: 0.71w/mk Flame retardant grade: 94V-0 Volume resistivity: 1.7 * 1010 Surface resistivity: 4.2 * 109 Density: 1.8gm/cm3 Surface technology: Sinking gold Special process: resin plug hole, pad size 0.15mm * 0.3mm Copper thickness: 1OZ

Product description

RO4003C is a patented material reinforced with woven glass cloth in a hydrocarbon resin system/ceramic filler. Its electrical properties are very similar to PTFE/woven glass cloth materials, and its processability is similar to epoxy resin/glass cloth materials.

RO4350B can adopt standard processing technology of epoxy resin/glass cloth, while providing strictly controlled dielectric constant and loss, and its price is a fraction of traditional microwave materials. There is even no need for special through-hole pre-treatment or operation procedures like PTFE based microwave materials. At the same time, it has passed the UL 94V-0 fire rating required for active equipment and high-voltage RF design.

Rogers Ro4003C high-frequency material, dielectric constant: 3.38 ± 0.05, loss factor: 0.0027, temperature coefficient of dielectric constant:+40, volume resistance: 1.7 × 10&10, surface resistance: 4.2 × 10&9, TG:>280,TD:425, Thermal conductivity: 0.64

Characteristics:

Low dielectric constant tolerance and low loss

Stable electrical characteristics at different frequencies
Low dielectric constant fluctuation with temperature
Low Z-axis expansion coefficient
Easy to mass produce


Special requirements:

This product is made by mixing a single Rogers Ro4003C 0.254mm medium high-frequency board material with FR4, which effectively solves the customer's high-frequency requirements

Low cost requirements

The precision requirement for the frequency line inside the board is+/-0.025mm, and the impedance is 100omh+/-10%

Using resin plug holes with no hole marks on the surface

 

With the rapid development of smart sensing technology, millimeter wave PCB for sensing applications has become a key component in advanced electronic systems. Designed for high-frequency signal transmission and accurate sensing performance, this PCB solution supports applications such as radar detection, automotive sensing, industrial monitoring, and intelligent devices. It provides stable signal performance and helps engineers build more reliable sensing systems.

Millimeter wave PCB for sensing applications features excellent high-frequency capability, precise circuit design, and strong signal integrity. Compared with conventional PCB solutions, it is optimized for complex sensing environments that require low signal loss and high accuracy. The advanced materials and manufacturing processes ensure stable operation under demanding conditions, while customized designs allow manufacturers to meet different application requirements. These advantages help reduce development difficulties, improve product performance, and shorten production cycles.

For example, an industrial equipment manufacturer needed a reliable sensing solution to improve monitoring accuracy and system response speed. By adopting millimeter wave PCB technology, the company achieved better signal transmission and more consistent detection results. The optimized PCB design helped reduce interference issues, improve equipment reliability, and support smarter industrial applications.

As industries continue to move toward automation and intelligent sensing, the demand for millimeter wave PCB for sensing applications is increasing. This high-performance PCB solution provides manufacturers with a practical way to overcome challenges such as unstable signals, limited sensing accuracy, and complex design requirements. With professional manufacturing support and flexible customization options, it helps customers create advanced electronic products with higher efficiency and competitive advantages.

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