YDS is a high-tech enterprise specializing in the research and development, manufacturing and service of PCB (Printed Circuit Board) and PCBA (Printed Circuit Board Assembly).

8L HDI  2+N+2 Mobile Main Board
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  • 8L HDI  2+N+2 Mobile Main Board

8L HDI 2+N+2 Mobile Main Board

Model : 2+N+2  Mobile Main Board Layers : 8Layers  Material : TG170 FR4 Construction : 2+4+2 HDI PCB Finished Thickness:0.8mm Copper Thickness : 0.5OZ Color : Green/White Surface Treatment:Immersion Gold+OSP Min Trace / Space:3mil/3mil Min Hole:Laser Hole 0.1mm Application : Mobile Main Board

Product description

HDI is the abbreviation of high density interconnector. High density interconnection (HDI) manufacturing printed circuit board (PCB) is a structural component formed by insulating material supplemented with conductor wiring. When printed circuit boards are made into final products, integrated circuits, transistors (transistors, diodes), passive components (such as resistors, capacitors, connectors, etc.) and various other electronic components will be installed on them. With the help of wire connection, electronic signal connection and function can be formed. Therefore, printed circuit board is a kind of platform to provide component connection, which is used to undertake the substrate of contact parts.

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