YDS is a high-tech enterprise specializing in the research and development, manufacturing and service of PCB (Printed Circuit Board) and PCBA (Printed Circuit Board Assembly).

Polytetrafluoroethylene (PTFE) microwave plate F4BM-255
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  • Polytetrafluoroethylene (PTFE) microwave plate F4BM-255

Polytetrafluoroethylene (PTFE) microwave plate F4BM-255

Product Name: Polytetrafluoroethylene (PTFE) Microwave Plate Plate: F4BM-2 Plate thickness: 1.6mm Number of floors: 2 Dielectric constant: 2.55 Medium thickness: 1.5 Tg:260 Thermal conductivity: 0.8w/mk Surface technology: Sinking gold Copper thickness: base copper 0.5OZ, finished copper thickness 1OZ Purpose: Microwave antenna

Product description

With the continuous development and progress of high-frequency microwave communication technology, the demand for microwave printed circuit boards is increasing. A large number of electronic products such as military and civilian radar, antennas, radio and television, mobile communication, fiber optic communication, computers, and household appliances all require microwave printed circuit boards.

However, traditional single and double-sided microwave printed boards can no longer meet the requirements of high line density and high precision, and the demand for processing multi-layer microwave printed boards is becoming increasingly urgent. But the manufacturing of multi-layer microwave printed boards is not that simple. In the manufacturing of multi-layer microwave printed boards, the United States has mastered everything.

High frequency PCB technology and products are playing an increasingly important role, and the development of high-frequency circuit substrate materials has also shown high-speed development. One of the more important aspects is the selection of materials with low dielectric constant and low dielectric loss factor, which is an important performance project for PCB substrate materials to achieve high-speed and high-frequency development.

Discuss the relationship between the dielectric constant and dielectric loss of substrate materials, and provide corresponding explanations on their relationship with the external environment, in order to enable reasonable and accurate evaluation and use of various substrate materials in PCB manufacturing.  

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