YDS is a high-tech enterprise specializing in the research and development, manufacturing and service of PCB (Printed Circuit Board) and PCBA (Printed Circuit Board Assembly).

RO4350B+FR4 high-frequency mixing plate
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  • RO4350B+FR4 high-frequency mixing plate

RO4350B+FR4 high-frequency mixing plate

Product Name: RO4350B+FR4 High Frequency Hybrid Plate Board: Rogers RO4350B+FR4 Number of floors: 4 Plate thickness: 1.5mm Copper thickness: 1OZ Medium thickness: 0.254 Dielectric constant: 3.48 Thermal conductivity: 0.69w/mk Flame retardant grade: 94V-0 Volume resistivity: 1.2 * 1010 Surface resistivity: 5.7 * 109 Density: 1.9gm/cm3 Surface technology: Sinking gold

Product description

Rogers RO4350B is a hydrocarbon/ceramic laminated board with a dielectric constant of 3.48, meeting the requirements of commercial grade equipment manufacturers for printed circuit boards

There are the following advantages:
1. Low RF loss
2. Temperature dependent fluctuation of low dielectric constant
3. Low Z-axis thermal expansion coefficient
4. Low board internal expansion coefficient
5. Low dielectric constant tolerance
6. Stable electrical characteristics at different frequencies
7. Easy to mass produce and FR4 multi-layer mixed pressure, high cost-effectiveness

Rogers RO4350B 0.254mm dielectric high-frequency material mixed pressure FR4 material side effect

 

The RO4350B+FR4 high-frequency mixing plate is designed to meet the growing demands of modern communication, radar, automotive electronics, and RF applications. By combining the superior high-frequency characteristics of RO4350B material with the cost advantages of FR4, this mixed-structure PCB provides an ideal balance between signal integrity and manufacturing efficiency. It enables engineers to achieve stable high-speed transmission while effectively controlling project costs.

Many electronic manufacturers face challenges such as signal loss, impedance instability, and rising production expenses when developing high-frequency products. The RO4350B+FR4 high-frequency mixing plate addresses these issues through excellent dielectric performance, low signal attenuation, and reliable thermal stability. The hybrid construction allows critical RF circuits to benefit from premium high-frequency materials while utilizing FR4 in less demanding areas, optimizing both performance and budget.

In practical applications, this solution has been widely adopted in wireless communication modules, antenna systems, automotive radar devices, and advanced networking equipment. Users report improved signal quality, enhanced product reliability, and reduced overall manufacturing costs. The structure also supports complex multilayer designs, helping engineers create compact and highly integrated electronic products.

As demand for high-speed data transmission continues to increase, the RO4350B+FR4 high-frequency mixing plate has become a preferred choice for innovative PCB development. With its combination of electrical performance, cost-effectiveness, and design flexibility, it helps manufacturers overcome technical challenges while accelerating product competitiveness in demanding high-frequency markets.

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